Magnesium alloy liquid cooler in Flat Panel Design
Magnesium alloy liquid cooler in Flat Panel Design
Magnesium alloy liquid cooler in Compact and Rectangular
magnesium alloy liquid cooler in Compact and Rectangular
The high-efficiency cooling solutions widely implemented in electronic devices including laptops and desktop computers. Magnesium alloys, characterized by their lightweight properties and exceptional thermal conductivity, serve as an ideal substrate for liquid cooling systems due to their rapid heat dissipation capabilities.
The core cooling module consists of precision-engineered magnesium alloy blocks designed to absorb operational heat from critical components such as CPUs. Through intricately designed internal micro-channels, coolant circulates within the alloy structure, effectively transferring thermal energy to finned radiator arrays where ultimate heat exchange occurs.
Key Advantages over Conventional Air Cooling:
Enhanced thermal management capacity supporting higher power loads
Significant acoustic improvement through elimination of fan-induced turbulence noise
Remarkable weight reduction exceeding 30% compared to copper-based equivalents, particularly advantageous for mobile computing devices
Implementation Considerations:
This advanced cooling solution presents two primary constraints: higher initial investment compared to standard cooling systems, and requirement for periodic coolant maintenance to ensure long-term operational stability.
Structural Design Characteristics:
Compact rectangular architecture: Optimized spatial efficiency with multi-dimensional fluid channels
Modular flat-panel design: Integrated magnesium alloy micro-channel matrix for seamless device integration
Serpentine flow path topology: Bio-inspired layout extending coolant residence time and effective heat transfer area
Multi-layered stack configuration: Composite cooling layers creating three-dimensional thermal networks
Custom form factors: Precision-shaped solutions for non-standard components (GPUs/CPUs)
System integration ready: Embedded within overall thermal management architecture
Standard Alloy Specifications:
AZ31 Series - Balanced Aluminum-Zinc (3:1) Formulation
Thermal conductivity: 138 W/m·K
Operating temperature range: -20℃ to 120℃
Typical applications: Standard-power electronic devices
AZ91 Enhanced Grade - High Aluminum Structural Reinforcement
Tensile strength: 230 MPa
Thermal fatigue resistance: ≥100,000 cycles
Recommended for: High-vibration environments
AM50 /AM60 Automotive Grade - Powertrain Cooling Optimized
Castability index: ≥85%
Corrosion resistance: Salt Spray 500h
Fluid compatibility: Ethylene glycol-based coolants
WE43 High-Temperature Specialty - Rare Earth Enhanced Formula
Continuous operating temperature: ≤300℃
Creep resistance: 200℃@150 MPa
Specialized applications: Aerospace avionics systems